
Increasingly complex products like Package on Package (PoP) or Fine Pitch Ball Grid Array Stacked Die (FBGA-SD) have intensified the requirements regarding accuracy and resolution. Also assembled and bare multilayer printed circuit boards (MLPCBs) with up to 48 layers or printed circuit boards with embedded layers of copper require special testing facilities that are equipped with powerful microfocus X-ray tubes.
Typical Applications
Non-destructive microfocus X-ray inspection in electronics industry, e.g.:
- Ball Grid Arrays (BGA), integrated circuits (IC), bond wires
- Semiconductor packaging (diodes, wafer bumps, copper)
- Shielded devices, housings, complete modules
- Wafer-level chips scale packages (WLCSP)
- Quad-Flat-Packages no-leads (QFN), similar components
- Printed circuit boards, hidden interconnects
- Bare boards, multilayer boards
- Power modules, IGBT modules
Impression of X-ray images



Recommended microfocus X-ray tubes for X-ray inspections in electronic industry
The microfocus and sub-microfocus X-ray tubes of the product lines T, THE, TC, TCHE Plus, TCNF, and TCNF Plus were developed for highest resolution X-ray inspection in electronics and semiconductor industries.
Microfocus transmission X-ray tubes - product line T
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Microfocus transmission X-ray tubes - product line THE
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Microfocus transmission X-ray tubes - product line TC
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Microfocus transmission X-ray tubes - product line TCHE Plus
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Microfocus transmission X-ray tubes - product line TCNF
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Microfocus transmission X-ray tubes - product line TCNF Plus
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